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Thermoelectric separation of copper substrate

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Name：热电分离铜基板

Model：HX-T003

Category：Thermoelectric separation of copper substrate

Product Features：
芯片位置中心焊盘处掏空绝缘层，且使铜基材与基板表面白油齐平！以达到高散热和精密连接的效果！

Description

芯片位置中心焊盘处掏空绝缘层，且使铜基材与基板表面白油齐平！以达到高散热和精密连接的效果！

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