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COB package copper substrate

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Name：COB封装铜基板

Model：HX-T005

Category：COB package copper substrate

Product Features：
应用于大功率类封装支架，100w以上封装产品安全使用，可在铜上加工镀银，镀金等工艺！COB封装铜基板！

Description

应用于大功率类封装支架，100w以上封装产品安全使用，可在铜上加工镀银，镀金等工艺！COB封装铜基板！

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